3+ day, 9+ hour ago   (207+ words) Infineon is sampling a dual-phase smart power stage family designed for AI accelerators and vertical power delivery modules. Integrating Infineon’s OptiMOS 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package, the new family delivers benchmark power density exceeding…...

3+ day, 23+ hour ago   (211+ words) Leankon is expanding its Near Field Communication or 13.56MHz NFC antenna portfolio with nine new products. The parts include the LK1860401 series, pictured. Designed to simplify the integration of 13.56 MHz technology with comms applications, the antennas are aimed at healthcare, access control,…...

6+ day, 9+ hour ago   (291+ words) Vishay’s new series of thin film chip resistors in 0402 and 0603 case sizes are built on an AlN substrate in SMT footprints. The Sfernice CHEP series deliver standard power ratings of 1.2 W in the 0402 case size and 1.8 W in the 0603 case…...

1+ week, 5+ hour ago   (210+ words) A strategic partnership between MRAM manufacturer, Everspin Technologies and Teledyne HiRel Semiconductors will mean that the 256Mb Persyst spin-transfer torque MRAM (STT-MRAM) will be used in Teledyne HiRel’s memory products for mil-aero customers. The MRAM combines RAM-like speed and the ability…...

1+ week, 5+ day ago   (171+ words) Efficient Power Conversion (EPC) is announcing mass production of its 100 V integrated GaN ePower Stage devices, for high-performance motor drives. The family comprises EPC23108, EPC23109, EPC23110 and EPC23111, and they are available through distribution partners such as Digi-Key and Mouser. The devices integrate high-side…...

1+ week, 5+ day ago   (222+ words) TI claims to be first to bring out a multiaxial coreless Hall-effect current sensor designed for all hybrid electric vehicle and electric vehicle (HEV/EV) traction inverter applications. The TMCS2100-Q1 sensor combines multiaxial measurement and a proprietary algorithm, eliminating the trade-off…...

2+ week, 6+ day ago   (293+ words) Nordic Semiconductor is announcing general availability for its multi-regional nRF93M1-LABA smart modem module now that it has Global Certification Forum (GCF) compliance. The module was first introduced at Mobile World Congress in March 2026. Also, it will start sampling the nRF93M1-LACA,…...

3+ week, 2+ hour ago   (196+ words) Following a Series A investment round which raised $40m, optical interconnect startup, Quintessent, is sampling its single-chip quantum dot-based DWDM (dense wavelength division multiplexing) comb laser. The design can be scales to more, or fewer, wavelengths and to additional CWDM wavelength…...

3+ week, 5+ hour ago   (1030+ words) What excites me most isn’t designing chips for artificial intelligence (AI) applications. It’s bringing the power of AI to the process of chip design and manufacturing itself. Based on what I’ve seen, I’m optimistic about the promise of greater innovation…...

3+ week, 9+ hour ago   (329+ words) Wi-Fi Halow USB dongle reference designs Electronics Weekly Wi-Fi Halow USB dongle reference designs Morse Micro has brought out two Wi-Fi HaLow USB Dongle Reference Designs that can bring long-range Wi-Fi HaLow connectivity to existing devices via a USB connection....